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IBM Brings Mainframe Technology and Career Opportunities to UIS Campus

The IBM University Tour showcased cutting-edge mainframe technologies and career opportunities in IBMZ, featuring the innovative IBM Telum II chip and AI integration across multiple industries.

The University of Illinois Springfield welcomed IBM and several industry partners to campus on Tuesday, September 16th for the annual IBM Fall University Tour, held from 4:00 PM to 6:00 PM in the Student Union North Ballroom.

  • Lucas Sahn IBM Z Skills Program Manager explaining IBM Z Xplore program - Upskill, reskill and new skill
  • Lucas Sahn from IBM Z showcasing all different technologies that can be a part of IBM Z mainframe tech
  • Lucas Sahn from IBM Z, stands next to a large screen displaying a grid of AI use cases for various industries, including financial services, insurance, and government.
  • Students of UIS at the IBM Tour Event for IBM Z program
  • CHST Dean Travis Bland introducing IBM and it's partners on the stage

The event featured comprehensive presentations on IBM's mainframe technologies, particularly focusing on the IBM Z platform and its applications across various industries.

The tour featured participation from numerous industry partners, creating networking opportunities for students:

  • Accenture
  • BMC Software
  • Broadcom
  • Illinois Department of Innovation & Technology (DoIT)
  • Levi, Ray & Shoup, Inc. (LRS)
  • 21CS
An IBM Telum II chip, with its metallic and green components

Lucas Sahn emphasized the critical role of the IBM Telum II chip in powering enterprise-class systems designed for IBM z17 mainframes, enabling real-time AI integration for mission-critical workloads such as fraud detection.

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